IR offers an extensive IGBT portfolio ranging from 300V to 1200V based on various technologies to achieve the highest performance for specific application requirements.

Additionally IR has a broad range of IGBT dies designed specifically for medium to high power modules with optimized layout, integrated Rg and large gate pad.

For modules which demand the highest reliability, Solderable Front Metal (SFM) die can be employed to eliminate bond wires allowing dual sided cooling which improves thermal performance, reliability and efficiency of the modules.