Resin bond diamond grinding wheel

Price:

10-2000

Quantity Order:

Origin:

China

Payment Method:

Telegraphic Transfer (T/T)

Pack. & Delivery:

in a carton

Resin bond grinding wheels have characteristics of good self-sharpening, sharp cutting, high efficiency, high resilience and best polishing, low roughness of work piece surface, less heat generating and without burning work piece, suitable for high efficiency and precision grinding.
Application:
Resin bond diamond grinding wheel: Mainly used for machining tungsten carbide, ceramic materials, optics materials, silicon materials, magnetic materials and so on.
Diameters: Æ 25— 750mm
Thickness: 5-300mm
Grit: 60/ 70^ W3.5
Concentration: 25, 50, 75, 100, 125, 150
Type: 1A1, 1F1, 1A1R, 6A2, 6A9, 3A1, 9A1, 11V9, 12A2, 14A1 etc.
Should you have any interests, Please feel free to contact.

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