Electroplating intermediates for Cu plating

Quantity Order:

Origin:

China

Payment Method:

Telegraphic Transfer (T/T)

Pack. & Delivery:

25kg drum

Our electroplating intermediates for Cu plating include the following products:
1. SP/ SPS ( Bis-( sodium sulfopropyl) -disulfide)
CAS No. : 27206-35-5.
2. MPS ( 3-mercapto-1-propane sulfonic acid, sodium salt)
CAS No.; 17636-10-1
3. DPS ( N, N-Dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt)
CAS No.: 18880-36-9.
4. UPS ( 3-S-isothiuronium propyl sulfonate)
CAS No.: 21668-81-5
5. ZPS ( 3-( Benzothiazolyl-2-mercapto) -propyl-sulfonic acid, sodium salt)
CAS No.: 49625-94-7

To get more information please feel free to contact me by jane@ brightchemical.com.cn or janechemical@ yahoo.com.cn.

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