Specification :

Number of layers: single, double or 4 to 10 layers
Copper thickness: 0.5 to 10oz Laminate material: FR-4, FR-1 or CME-1 Base board thickness: 0.3 to 4.0mm Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nickel plating and gold finger Twist: 0.5*37; Insulation resistance: 10 ohms (11 ohms) Test voltage: 150 to 300V Thermal cycling ability: 288 degrees Celsius/5 seconds Finished board area: 560 x 610mm Minimum line width and spacing: 0.1/0.1mm Copper thickness in hole: 25.0*956;m Minimum pad diameter inner layer: 0.5mm Minimum hole diameter: 0.25mm PTH: +0.075mm NPTH: +0.05mm Hole location tolerance: +0.075mm Profile tolerance CNC routing: +0.15 Profile tolerance CNC punching: +0.15 Solder mask bridge ability: 0.1mm Solder mask rigidity: 6 hours Solderable test: 245 degrees Celsius/5 seconds Imcombustibility: 94V Inner: vacuum/plastic Outer: standard carton Thermal cycling ability: 288 degrees Celsius/5 seconds Finished board area: 560 x 610mm Minimum line width and spacing: 0.1/0.1mm Copper thickness in hole: 25.0*956;m Minimum pad diameter inner layer: 0.5mm Minimum hole diameter: 0.25mm PTH: +0.075mm NPTH: +0.05mm Hole location tolerance: +0.075mm Profile tolerance CNC routing: +0.15 Profile tolerance CNC punching: +0.15 Solder mask bridge ability: 0.1mm