Specification :

1. The machine selects the infrared highly effective component to give off heat which independent exploration, adopt advanced PID intelligent controlling warm heating technology, controls warm precisely.
2. Can achieve to heat PCB board and component which contains lead or not especially suit to BGA
SMD.
3. Use infrared heat, easy to cut through, heat proportion, don’ t have sirocco flow. Don’ t shift the small component on the PCB board ensure the welding quality.
4. This machine has 600W heating system, widely to 120x120mm.Can use with the handhold infrared welder T-835.
5. Easily operate, can operate it through easy training.
Main Parameter
Work floor size 200x240mm
Rated voltage and frequency AC220-230v/ AC110V 60/ 50Hz
Complete machine power 800W
Preheating chassis power 600W
Preheating chassis size 120x120mm
Preheating chassis temperature adjustable 0-450