Specification
Introduction to the Product ;
XA090-P1 is equipment that automatically executes precision alignment and cohesion between layers of boards including Stack Via, Nero Manhattan Bump Interconnection.
( NMBI) , Flip-Chip and BGA board which are cutting edge PCB manufacturing technique
Now you can experience more efficient product manufacturing with equipment appropriate for manufacturing technology of advanced engineering.
Applicable subjects:
- Stack via PCB, NMBI ( Neo Manhattan Bump, Interconnection) PCB,
- Board for Flip-Chip application,
- Board for BGA application.
Main Features:
- High precision alignment function ( Resolution : 2§  )
- Mark inspection simulation function,
- Manufacturing management / statistics management
- Precision automated calibration function
- Uses closed-tube for which maintenance is convenient
- Measurement for quality management / Provision of analysis program
Distributor, Agent, Penjualan, Pemasangan dan Training.
Jakarta - Indonesia
PT TAHARICA
Kontak Person: Sri dan Bpk. Muslim ( 08159072797 ) .
Alamat: Jl. Pahlawan Revolusi No. 22B.
Telp. + 62-21-8611 131, 8611 259, 8611 444, 8611 449
Fax : + 62-21-8611 207.
EMAIL : sales@ taharica.com
Website: http/ / www.taharica.com