Specification: 8L( 1+ 6+ 1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing....
Head Electronic Co., Ltd. is an experienced professional manufacturer of printed circuit boards in mainland China since 2000. We are specialized in PCB manufacturing, PCB prototype and PCB....
Layer: 2L Base Material: CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/ Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut ....
Layer: 12L, Base Material: FR-4 Board Thickness: 1.6mm, buried and blind via, BGA plug Final copper: 35um, impedance control Surface Finish: Immersion Gold, Au: 3uâ € ť min. Solder mask....
Layer: 1L Material: Aluminum Board thickness: 1.6mm Surface technique: ImmersionGold Minimum hole size: 0.6mm Application field: LED, Automobile
Layers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/ space: 8/ 5.9 miles, Thickness: Rigid board: 2.00mm, Flex....
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/ 2mil, 1 to 10 mil ....
Layer: 10L Base Material: FR-4 tg180( ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Gold/ Au: 2uâ € ť min. Gold fingers/ Au: 30uâ € ť Solder mask: Green Profile: ....
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au: 3uâ € ť min. Impedance control Profile: ....