" Flex, rigid flex, and rigid PCB form factors SMT, through-hole, and mixed technology Board sizes up to 18 x 14 Complex, high density assemblies PBGA, CBGA, TBGA, FPGA, CGA, LGA Package....
Hemeixin Electronics Co., Ltd is one of the leading overview manufacturers and suppliers, we are always able to offer you low price overview. Welcome to Hemeixin, we will offer our best solution for....
" Strict requirement for time sequence; Multiple pairs of 3.12G signals, 48 pairs of 1.25Gsignals, and each pair of signal is 13 inches long; Strictly controlled impedance, various kinds ofpower....
" Hemeixin has six years of professional design experience, complete flow system, and perfect technical support business Support mainstream design tools in the industry: Allegro, Pads, and Mentor....
" Parameters sweeping Electrical Rules Topological definition Physics, spacing Rules Static timing analysis Topological Rules Transmission path optimization Impedance rule and length match Post....
" Reduced time to market is key to success. we are experts in providing quick-turn services to customers worldwide. Hemeixin delivers speed and agility through: High-quality service Exqiuste....
" Single-sided flexible circuits havea single conductor layer made ofeither a metal or conductive( metal filled) polymer on a flexibledielectric film. Component termination features are accessible....
" Double-sided flex circuits are flexcircuits having two conductor layers.Theses flex circuits can be fabricated with or without plated through holes.Depending on design requirements, double-sided....
" Flex circuits having three or more layers of conductors are known as multilayer flex circuits. Commonly the layers are interconnected by means of plated through holes, though this is not a....
" Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure.The layers of a rigid flex are also....
" 20 sets UV/ YAG and over 160 CO2 laser heads ELIC ( Every Layer Interconnection) Skipped, telescopic, stacked vias 30 layers Min. microvia - 80 m Soldermask Registration: 25 m using ....
" Advanced thermal management and embedded coin technology High Performance and Emerging Materials; Halogen free, low loss, ultra-thin, mixed packages, inlay Sequential Lamination High Tech....
" Nelco N4000-12/ N4000-12SI Nelco N4000-13EP/ N4000-13EPSI Nelco N8000 Isola FR408, FR 408 HR Isola IS 415 Hitachi LX-67Y, FX II Rogers RO, 4350B, RO4450B, RO4350F, RO4003 Getek Panasonic....
" Depending on the power load and power dissipation, copper levels of inner layers at thickness of 105 micron, 210 micron, 400 micron or 700 micron Copper thickness of outer layers variable from....