Technical parameters:
1. Wafer Diameter: 100mm
2. Wafer thickness: 245 5 m
3. Back Metal thickness: Ti 1000A+ Ni 4000A+ Ag 5000A
4. Front Metal thickness: pure Al 4.5 m
5. Wafer surface....
See more »Founded in 2001, Dandong Huaao Electronics Co., Ltd. specializes in the development, design, production, popularization application, service of the integrated circuit and transistors for automobile....