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Shanghai Meisongbei Electronics Co., Ltd

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Shanghai Meisongbei Electronics Co.,  Ltd
Shanghai Meisongbei Electronics Co., Ltd
China
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    Surface-mount multi-layer chip array beads

    Quantity Order:
    Origin:
    China
    Payment Method:
    Telegraphic Transfer (T/T)

    Specification :

    Magnetically shielded chip inductor
    Large-current chip inductor
    Low DCR chip inductor
    Low profile 1.0mm maximum height SMD power inductor
    SMT power inductor
    Shielded power chip inductor
    Miniature SMD chip inductor
    Shielded SMT power inductor
    Low profile power inductor
    Low DCR SMD power inductor
    Large-current SMD power inductor
    SMD magnetically shield power inductor
    Shielded SMD power chip inductor
    Magnetic shielded surface mount inductor with high current rating
    Low profile and shielded very effective in space-conscious applications
    Low resistance to deep power loss minimum
    Operating temperature: -20 to 85 degrees Celsius ( contain heating coil)
    Appearance inspection: no external defect by visual inspection
    Terminal strength: after soldering, between copper plate and terminals of coil, push in two directions of X, Y with standing as below conditions
    Terminal should not peeled off
    Heat endurance of re-flow soldering: 240
    Insulating resistance: over 100M© at 100V DC between wire and core
    Dielectric strength: no dielectric breakdown at 100V DC for one minute between wire and core
    Temperature characteristic: inductance coefficient ( 0 to 2, 000) x 10-6/ ( -25 to + 80° C) inductance deviation within ± 5.0% , after 96 hours
    Humidity characteristic: in 90 to 95% relative humidity at 40± 2 and one hour drying under normal condition
    Inductance deviation within ± 5.0% after vibration for one hour
    Vibration resistance: in each of three orientations at sweep vibration ( 10-55-10Hz) with 1.5mm p-p amplitude
    Similar to coil craft and Toko, Sumida, TDK and Murata brands
    Surface-mount wire-wound Ceramic chip inductors
    Surface-mount wound molded chip inductors
    Surface-mount multi-layer chip array beads



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