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    SPS Copper electroplating intermediate

    SPS Copper electroplating intermediate

    Quantity Order:
    Origin:
    China
    Payment Method:
    Telegraphic Transfer (T/T)
    Pack. & Delivery:
    25kg

    Specification :

    SP/ SPS
    Chemical name Bis-( sodium sulfopropyl) -disulfide
    Molecular formula C6H12O6S4Na2
    Molecular weight 354.4
    CAS No. 27206-35-5
    Characteristic:
    Appearance White or yellowish powder
    Assay( % ) e90.0
    Solubility( 20 ) 38% ( in water)
    PH 3-7 ( 38% water solution)
    Concentration in the bath 10-100mg/ L
    Application As a brightener agent for acid copper baths for decorative and functional deposits, it is functionally compatible with most components of typical copper bath formulation such as non-ionic surfactants, polymeric amines and other mercapto compounds.

    Pakage 25kg
    Storage condition Stored in cool and dry place
    Valid period( year) 2



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