Technical parameters: 1. Wafer Diameter: 100mm 2. Wafer thickness: 245 5 m 3. Back Metal thickness: Ti 1000A+ Ni 4000A+ Ag 5000A 4. Front Metal thickness: pure Al 4.5 m 5. Wafer surface....
Founded in 2001, Dandong Huaao Electronics Co., Ltd. specializes in the development, design, production, popularization application, service of the integrated circuit and transistors for automobile....