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    KIT3000 ARM Development Kit ( ARM11 board)

    KIT3000 ARM Development Kit ( ARM11 board)

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    Specification :

    KIT3000 Highlights

    . CPU Board MINI6410/ MINI2416/ MINI2450 share same carrier board EM3000
    . Processor: Samsung S3C6410, ARM1176JZF-S, up to 667MHz. Or Samsung ARM9 S3C2416X , up to 400MHz,
    Or Samsung ARM9 S3C2450, up to 533MHzm
    . 128MB SDRAM
    . 256MB NAND Flash
    . 2M Bytes NOR Flash
    . 4 2.0 Full Speed 12Mbps USB Host
    . 1 2.0 High Speed 480Mbps USB OTG
    . 6 serial ports ( Two are five-wire RS-232 DB9 interface, another two are three-wire TTL serial port
    led out from a 20-pin expansion connector)
    . Two kinds of LCD/ Touch Screen interface. Supporting 3.5 inch TFT LCD, 4.3 inch TFT LCD and 7 inch TFT LCD.
    . Many modules are available for your choice- GPS, WIFI, Camera, Bluetooth and AV Module.
    . 50-Pin GPIO connector , 50-Pin data and address BUS connector
    . One audio input interface ( 3.5mm audio jack)
    . One 2-channel audio output interface ( 3.5mm audio jack)
    . One 10/ 100M Ethernet interface ( RJ45)
    . One High-speed USB2.0 OTG port ( Mini USB type interface)
    . SD/ MMC interface ( supports 3.3V and 1.8V logic voltage)
    . Two camera interfaces ( 30-pin FPC connector, support CCD or CMOS camera)
    . One 20-pin JTAG interface, one 10-pin CPLD JTAG interface
    . Eight buttons ( Reset, Boot, User defined, On/ Off)
    . One TVOUT
    . Power supply: + 12V
    . Dimensions: carrier board-200mm x 140mm; CPU board-81.2mm x 55.8mm

    The KIT3000 is a develpment board designed for the customer who wants to dedicate their carrier board and application development.
    The kit supports three versions of CPU Moudle which seperately based on ARM11 Samsung S3C6410, ARM9 S3C2450 and ARM9 S3C2416.The customer spends lowest cost but can estimate three CPU and its kit relative software package, then finaly select exactly a CPU and CPU Moudle that totally meet their specification.The KIT not only reduce the customer' s development cost but also accelerate time to market.

    The kit includes the CPU Board and Carrier Board, LCD, Windows Embedded CE 6.0 or Linux OS BSP, complete electronic documentation, schematics, demo applications, and third party Cross compilers ( Arm-none-linux-gnueabi, 3.3.2 , 3.4.1 , 4.2.2-eabi) and embedded development environments ( DNW, MoviNAND_Fusing_Tool.exe, activesync, sdboot, TCPMP, USB Interface Driver and so on) for evaluation.



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