Aluminium PCB

Price:

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Quantity Order:

Origin:

China

Quantity:

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Pack. & Delivery:

vacuum-packing

Product Finishing
Liquid photo-imageable solder mask (LPI)
Peelable solder mask
Conductive Carbon Ink
Hot Air Solder Leveled finish (HASL), with thickness of 80 to 1,000 microinches (2.0-25 micron)
Organic Solderability Preservatives: Entek Cu 106A HT, Preflux F2 LX
Electrolytic Flash Gold with thickness of 0.4 to 3.0 microinches (Au:0.01 to 0.076 micron; Ni:5~15 m m)
Selective Immersion Gold with thickness of 1 to 4 microinches (Au:0.025 to 0.1 micron; Ni:2.54~5.5 m m)
Gold tab/finger plating with thickness of 5 to 30 microinches (Au:0.125 to 0.76 micron; Ni:1.27~12 m m )
Electroless Immersion Tin with thickness of 20 to 48 microinches (0.5 to 1.2 micron)

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