Specification :

Lead Free process
Double-side SMT + Thru-hole
High-speed Pick & Place + Wavesolder
Quick turn & Prototyping our specialty
Design Review for Manufacturability
Flex Circuit Assembly
¼ BGA, CSP, BGA attach to 0.50 mm max size
Fine-pitch SMT, QFP down to 16 mil pitch
Pick & Place 0402 components
Small Parts Assembly and Soldering
Rework, Parts Recovery, Rebuild
Connector and terminal press-fit capability
Water Soluble processes + Aqueous Cleaning
Consignment, Turnkey Service