POLYIMIDE FILM

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Origin:

China

The polyimide film produced was formed by polymerization and cyclization of polyamic acid resulted from polycondensation of pyromellitic dianhydride with 4.4’-diaminodiphenyl ether in polar solvent.
This polyimide film possesses a series of excellent properties, temperature-resistance, radiation-resistance, temperature range from-169 to250
In addition, it has following advantages:
1.Complete set of film thickness from 0.02mm to 0.2mm, other size may be processed as reguest.
2.A close tolerance of film thickness, its tensile strength, percentage of rupture elongation and breakdown voltage much better than those described in standard JB/T2726-1996.
3.Unique film surface (monoside) coursing process technology enhancing greatly compound bonding strength compared with other bonding technology at the same conditions.

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