Specification :

1. layer: 1-22
2. Board finished thickness: 0.2mm-7.0mm
3 . Meterial: FR4, CEM-3, High TG, FR4 Halogen Free, Rogers
4. Max. Finished board size: 580* 900m
5. Min hole size: 4mil( 0.1mm)
6. Min trace width/ space: 3.5mil
7. Surface finishing/ treatment: HASL/ Lead free HASL, Imemersion sliver, immersion Tin, OSP
8. Copper thickness: 0.5oz to 6oz
9. solder mask color: green/ yellow/ black/ red/ blue
10. Copper thickness in hole: > 18um
11.Outline tolerance : + / -0.13mm
Hole size tolerance: PTH+ / -0.076mm NPTH+ / -0.05mm
12.Quality ensure: UL approval TS16949: 2002
13.Buried and Blind vias, impedance control , via plug, BGA soldering, Gold finger